Our focus is currently on high density hardware and not on standard servers, which only come with a couple of CPU cores and a little bit of memory to be cooled. High density hardware such as HPC (high performance computing) systems, supercomputers, GPU clusters with NVIDIA accelerators, nodes enhanced with FPGA cores or parallel processors such as the Intel® Xeon Phi™ coprocessor. High density specialised electronics such as pure FPGA clusters are also ideal candidates for immersion cooling.
Standard servers are very bulky and waste a lot of space for their heatsinks, fans and air channels. One of the major technical advantages of immersion cooling is that you don't need all that. It allows true high density systems with hardware packed in very small spaces. Server and hardware manufacturers start to realize the potential of this technology and the growing demand for cloud computing hardware (a large number of identical boards) is definitely helping to make a case for immersion cooling.
That's why we are looking forward to manufacturers making their systems more dense and to data centers becoming more energy efficient.