The DataTank™ container modules are designed for inexpensive, efficient and rapid cluster deployment. The standard configuration of the DataTank™ Container Unit is no less than 1.4 Megawatts per prefabricated container and tanks can be equipped with high performance condensers of up to 500kW per flat rack tank for extremely demanding applications. Tanks are provided with 19-inch rails, Open Rack or custom form factors will be available in the future.
DataTank™ modules are our third generation systems for 3M™ Novec™ Engineered Fluids, designed for a a PUE of 1.01 or less even in hot and humid Asia. Using passive 2-phase immersion cooling guarantees highly efficient systems, no matter in cold climates, hot climates, or harsh environments such as the desert. Hardware is always cooled efficiently and without any temperature fluctuations.
All DataTank™ systems are built into ISO container modules and can be handled using standard equipment such as cranes, ships, trucks and trailers. Multiple containers can be stacked and combined for large-scale container farm deployments. On demand, the DataTank™ infrastructure can also be installed into traditional brick-and-mortar facilities.
DataTank™ Flat Racks are modular immersion cooling tanks with standard capacities of 200-240kW. For extremely demanding applications, tanks can be equipped with high performance condensers of up to 500kW per flat rack tank. Current systems are provided with 19-inch rails, Open Rack or custom form factors will be available in the future.
DataTank™ Flat Racks are designed for our DataTank™ Container Units. Tanks for installation in traditional brick-and-mortar facilities are available on demand.
For a free immersion cooling project evaluation, feel free to use our immersion cooling evaluation form. You'll be surprised how beneficial immersion cooling can be, even on a smaller scale.
The DataTank™ immersion cooled modular data center system allows inexpensive, efficient and rapid deployment of Supercomputer, HPC, GPU or ASIC clusters at unprecedented power densities. The patent-pending designs include full infrastructure from power distribution to immersion cooling, automation and monitoring.
With the only site requirement being power and network, deployment is unusually simple. Hardware is reduced to not much more than chips on boards, with no further mechancial infrastructure required.
Traditional cooling systems that use air, water or oil are complex and costly. The simplified approach of open bath immersion cooling offers a true alternative solution, saving large amounts of energy, greenhouse emissions and space. It also resolves a number of today’s engineering bottlenecks, allows manufacturers to build better hardware without heat transfer constraints, while also being much cheaper and less complex to build.
It's an open and future proof platform and it will play an important role in solving the energy crises we see in datacenters today.
Removes thermal bottlenecks from device and facility level. No thermal overhead for hardware designers.
Lowest PUE possible, even without free cooling. Hardware runs cooler and faster without thermal throttling.
Hardware is reduced to not much more than chips on boards, does not require fans, water blocks or pumps. Fluid is all that's needed.
Same simple infrastructure no matter if you run 20kW, 200kW or 500kW per rack.